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You are here:     Home Processes Specialization Areas High Thickness Copper Plating

High Thickness Copper Plating

High thickness copper plating without nodule growth is a challenge which Progvins has mastered through its know-how and fine tuning of our in house chemistry. At Progvins we were among the earliest pioneers for high thickness copper plating on utensils in an automatic plant. Progvins high thickness copper plating retains pure copper's thermal conductivity and aesthetic appearance. Our Electroforming processes enable the deposition of several hundred microns thickness, irrespective of the complexity of the structure.